|By PR Newswire||
|January 7, 2013 09:55 AM EST||
LAS VEGAS, Jan. 7, 2013 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced an automotive OMAP™ processor built to bring unprecedented in-vehicle entertainment and telematics functionality to automobiles. Codenamed "Jacinto 6," the new DRA74x processor builds upon TI's proven OMAP 5 architecture to enable optimized automotive solutions, adding audio, analytics and radio accelerators, along with automobile interfaces and peripherals. Integrating automotive interfaces with the processor architecture can decrease an automotive infotainment customer's electronic bill of materials (BOM) by up to 25% or more, while delivering best-in-class performance capabilities. For more details, visit the Jacinto 6 web page.
"Today's consumers expect always-on connectedness, with information and entertainment at their fingertips in every environment – at work, at home, at play and on the road," said Curt Moore, general manager of automotive for TI's OMAP product line. "Jacinto 6 links people, their vehicles and the world around them via rich user interfaces, 3D navigation, real-time, high-definition, (HD) video and other interactive capabilities. With TI infotainment processors designed into more than a dozen automobile manufacturers delivering feature-rich infotainment systems, TI is excited to work with our customers to drive automotive infotainment performance to the next level with Jacinto 6."
DRA74x automotive OMAP processor
With the OMAP 5 architecture at its foundation – including dual ARM® Cortex™-A15 cores, dual Cortex-M4 cores and multi-Imagination Technologies' POWERVR™ SGX544-MPx graphics cores – the latest DRA74x ("Jacinto 6") processor increases ARM CPU performance up to five times and graphics (GPU) performance close to seven times as compared to the previous "Jacinto 5" offering. It also adds the following elements to the OMAP 5 processor foundation, to address specific automotive-infotainment needs:
- AEC Q100 qualification and wide-temperature support.
- Automotive interfaces: 2x CAN, MOST Media Local Bus (MLB), PCIe, Ethernet AVB, 3.3V I/Os.
- Optional 680 MHz floating-point VLIW DSP for integration of software defined radio, advanced audio and speech processing.
- Multiple high-definition camera and video input ports to enable next-generation surround-view camera and consumer devices.
- Robust software ecosystem, including support for QNX, open-source Linux, and Android.
- Pre-integration of TI's WiLink™ 8Q wireless automotive connectivity solutions
Infotainment leaders echo support for TI's Automotive OMAP ("Jacinto") processor family
With an ecosystem of leading automotive partners, TI is proud to work with industry leaders to engineer the future of in-vehicle capabilities. Many of those ecosystem players leverage TI's "Jacinto" processors and applaud the launch of the latest Jacinto 6 offering:
The automotive infotainment market has shifted dramatically in the past five years, as cars transform into portable command centers," said Jugal Vijayvargiya, senior vice president of Delphi and president of Delphi Electronics & Safety. "Delphi delivers real-world solutions to drive this shift, with innovative implementations of connectivity technologies, speech recognition, audio streaming and more. We are proud to work with key partners like TI in the process, and look forward to "Jacinto 6" enhancing tomorrow's in-vehicle infotainment experiences."
"With an estimated 25 million vehicles on the road today featuring HARMAN's audio and infotainment, our team works closely with partners such as TI to redefine the automotive infotainment experience," said Michael Mauser, executive vice president and co-president, infotainment and lifestyle divisions, HARMAN. "As the latest in the line of TI's reliable, scalable OMAP processors, "Jacinto 6" helps us deliver on the promise to bring consumers seamless, feature-rich infotainment capabilities for a safer, more enjoyable ride wherever they may travel."
"At Panasonic Automotive Systems Company of America, we seek out technology partners such as TI that share our same passion for crafting more exciting, informative driving experiences," said David Taylor, director, research and advanced development, Panasonic Automotive Systems of America. "The launch of "Jacinto 6" is a major step forward for automotive manufacturers hoping to integrate next-generation infotainment capabilities in upcoming vehicles, and we look forward to seeing how "Jacinto 6" transforms the way passengers and drivers experience navigation, multimedia and other interactive capabilities on the road."
"For more than 10 years, TI and QNX have worked closely to enable innovative, connected automotive solutions, which have changed the way people interact with in-vehicle and carry-in electronics," said Linda Campbell, director of strategic alliances, QNX Software Systems. "Jacinto 6 brings new levels of performance, power, and optimization, enabling us to bring game-changing innovations to model year 2014 vehicles and beyond. We look forward to continued successes with TI and to working together to bring best-in-class, Jacinto-processor-based features to cars across the globe."
The DRA74x "Jacinto 6" processor will sample in mid-2013 and is expected to be available for production by the second half of 2014. As with other OMAP processors, the DRA74x is intended for high-volume automotive manufacturers and is not available through distributors.
Texas Instruments drives automotive innovation
TI's state-of-the-art semiconductor products allow manufacturers and system suppliers to deliver world-class features to the automotive market. Our extensive automotive portfolio includes analog power management, interface and signal chain solutions, along with DLP® displays, ADAS and infotainment processors, Hercules™ TMS570 safety microcontrollers and wireless connectivity solutions. Complete with excellent product documentation, TI offers parts that are compliant with the AEC-Q100 and TS16949 standards, along with SafeTI™ products, which also comply with ISO 26262 requirements. Click here to learn more.
- TI's CES activities, including automotive-focused demonstrations
- Behind the Wheel blog on TI's E2E™ community
- Overview of TI's automotive infotainment solutions
- Overview of TI's complete automotive portfolio
- Automotive forum on TI's E2E Community
- TI on Twitter
- TI on Facebook
- TI on Google +
About Innovation at TI
For more than 80 years, TI has been at the forefront of technical innovation, enabling customers to differentiate products with higher integration, faster speeds and lower power. Today, we are engineering the future with advances in energy harvesting, power management, cloud computing, safety and security, health technology, and more. Learn more about how TI's Analog and Embedded Processing products are improving how we live, work and play, today and well into the future, athttp://www.ti.com/innovation.
About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.
OMAP, Hercules and TI E2E are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.
SOURCE Texas Instruments
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